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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11647587 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Apr. 06, 2022

Power module structure

Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Da Jin, Taoyuan, TW;

Kun Jiang, Taoyuan, TW;

Junguo Cui, Taoyuan, TW;

Yahong Xiong, Taoyuan, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan, TW;

Attorneys:

Kirton McConkie

Evan R. Witt

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H01F 27/26 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/34 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/145 (2013.01); H01F 27/266 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/34 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 3/3494 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10734 (2013.01);
Abstract

The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

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