The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Jun. 23, 2021
Applicants:
Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Xiaolong Zhu, Beijing, CN;
Hengzhen Liang, Beijing, CN;
Assignees:
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/028 (2013.01); H05K 1/147 (2013.01); G06F 3/041 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09572 (2013.01); H05K 2201/10128 (2013.01);
Abstract
A flexible printed circuit for bridging is provided. The flexible printed circuit has at least one via, at least one overflow groove is provided at a first distance from an edge of the via, and the overflow groove is provided in a cover layer on a side of a soldering surface of the flexible printed circuit.