The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Jun. 01, 2018
Applicant:

Im Advanced Materials Co., Ltd, Gyeonggi-do, KR;

Inventors:

Ji Hun Park, Seoul, KR;

Seung Yeon Lee, Gyeonggi-do, KR;

Seong Hwan Lim, Gyeonggi-do, KR;

Yeo Jo Yoon, Gyeonggi-do, KR;

Hye Jin Kim, Gyeonggi-do, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F24C 15/32 (2006.01); F24C 15/20 (2006.01); H05B 3/86 (2006.01); H05B 3/14 (2006.01); H05B 3/16 (2006.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H05B 3/86 (2013.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01); H05B 3/141 (2013.01); H05B 3/16 (2013.01); H05B 2214/02 (2013.01);
Abstract

Disclosed is a heating device, including a substrate, a metal oxide layer formed on the substrate, hyper heat accelerator dots having a spherical shape formed on the metal oxide layer and arranged in a lattice form, and a conductive adhesive layer formed on the metal oxide layer and the hyper heat accelerator dots, wherein the lower portions of the hyper heat accelerator dots having a spherical shape are included in the metal oxide layer and the upper portions thereof are included in the conductive adhesive layer.


Find Patent Forward Citations

Loading…