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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11647338 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Jun. 14, 2021

Flexible piezoelectric acoustic sensor fabricated integrally with si as the supporting substrate, voice sensor using thin film polymer and voice sensor with different thickness and voice sensing method using same

Applicants:

Korea Advanced Institute of Science and Technology, Daejeon, KR;

Fronics Inc., Daejeon, KR;

Inventors:

Keonjae Lee, Daejoen, KR;

Young Hoon Jung, Daejeon, KR;

Jae Hyun Han, Daejeon, KR;

Hee Seung Wang, Daejeon, KR;

Mingi Chung, Daejeon, KR;

Assignees:

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon, KR;

FRONICS INC., Daejeon, KR;

Attorney:
Primary Examiner:

Kenny H Truong

Int. Cl.
CPC ...
H04R 17/02 (2006.01); H10N 30/88 (2023.01); H10N 30/20 (2023.01); H10N 30/853 (2023.01); H10N 30/078 (2023.01); H04R 3/04 (2006.01); H04R 1/04 (2006.01); H04R 17/00 (2006.01); H04R 7/04 (2006.01); H03F 3/183 (2006.01); H01L 41/053 (2006.01); H01L 41/09 (2006.01); H01L 41/187 (2006.01); H01L 41/318 (2013.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); H01L 41/0533 (2013.01); H01L 41/0973 (2013.01); H01L 41/1876 (2013.01); H01L 41/318 (2013.01); H03F 3/183 (2013.01); H04R 1/04 (2013.01); H04R 3/04 (2013.01); H04R 7/04 (2013.01); H04R 17/005 (2013.01); H03F 2200/03 (2013.01); H04R 2307/025 (2013.01); H04R 2440/01 (2013.01);
Abstract

Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.

Find Patent Forward Citations

Lee, Keonjae. (2023). Flexible piezoelectric acoustic sensor fabricated integrally with si as the supporting substrate, voice sensor using thin film polymer and voice sensor with different thickness and voice sensing method using same (U.S. Patent No. 11647338). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11647338

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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