The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Jul. 23, 2021
Applicant:

Azurewave Technologies, Inc., New Taipei, TW;

Inventors:

Tseng-Chieh Lee, New Taipei, TW;

Kung-An Lin, New Taipei, TW;

Chih-Yuan Chuang, New Taipei, TW;

Chien-Che Ting, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/57 (2023.01); H04N 23/54 (2023.01); G02B 5/20 (2006.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); H04N 23/54 (2023.01); G02B 5/20 (2013.01);
Abstract

A portable electronic device and a customized image-capturing module thereof are provided. The customized image-capturing module includes a carrier substrate, an image-capturing chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads, and a plurality of second conductive pads. The image-capturing chip is disposed inside a concave space of the carrier body, and the image-capturing chip includes a plurality of conductive chip pads. The second conductive pads are exposed from a bottom side of the carrier body, the conductive chip pads are electrically connected to the second conductive pads through the first conductive pads, respectively, so that when the customized image-capturing module is partially disposed inside a receiving space and positioned between two electronic elements, the second conductive pads can be electrically connected to conductive substrate pads of a circuit substrate through soldering materials, respectively.


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