The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

May. 17, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuna Oyama, Kanagawa, JP;

Norikazu Hirota, Kanagawa, JP;

Yoji Oya, Kanagawa, JP;

Kazuo Yamamoto, Tokyo, JP;

Yuta Nakamura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
Abstract

An image pickup apparatus that can efficiently solve problems caused by heat generated by a heat generating element. The image pickup apparatus including a sensor substrate configured to implement an image sensor, and a main circuit board configured to implement a heat generating element. A length of the main circuit board is longer than a length of the sensor substrate in a width direction of the image pickup apparatus. The main circuit board is aslant arranged to an optical axis of the image pickup apparatus so that a first space part will be provided between the sensor substrate and the main circuit board. A cross section of the first space part in a plane that is parallel to both the optical axis and the width direction is approximately triangle.


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