The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
May. 20, 2019
Kitagawa Industries Co., Ltd., Inazawa, JP;
Tetsuya Yada, Kasugai, JP;
Tatsuya Nakamura, Kasugai, JP;
KITAGAWA INDUSTRIES CO., LTD., Inazawa, JP;
Abstract
[Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member. [Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface. In the gap forming portion, a concave portion is provided between a first end portion and a second end portion, and is configured to have a gap between the concave portion and the component mounting surface when the base portion is soldered on the component mounting surface in a state in which the concave portion and the component mounting surface are oriented in directions facing each other.