The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Sep. 20, 2021
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Eiji Tsukuda, Tokyo, JP;

Katsumi Eikyu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78391 (2014.09); H01L 29/42328 (2013.01); H01L 29/6684 (2013.01); H01L 29/66484 (2013.01); H01L 29/7831 (2013.01); H01L 29/6656 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate, a first dielectric film, a conductive film, at least one ferroelectric film, a second dielectric film, a memory gate electrode, a third dielectric film and a control gate electrode. The semiconductor substrate includes a source region and a drain region. The semiconductor substrate includes a first region and a second region between the source region and the drain region. The first dielectric film is formed on the first region. The conductive film is formed on the first dielectric film. The at least one ferroelectric film is formed on one hart of the conductive film. The second dielectric film is formed on the other part of the conductive film. The memory gate electrode is formed on the ferroelectric film. The third dielectric film is formed on the second region. The control gate electrode is formed on the third dielectric film.


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