The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Dec. 02, 2020
Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Sunghoon Kim, Gyeonggi-do, KR;

Dongchae Shin, Gyeonggi-do, KR;

KyungMo Son, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/15 (2006.01); H01L 27/32 (2006.01); H01L 25/16 (2023.01); H01L 25/07 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1218 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0804 (2013.01); H01L 25/167 (2013.01); H01L 27/156 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01);
Abstract

Embodiments of the disclosure are related to polyimide substrates and display devices, a plurality of intaglio patterns are formed on at least a portion of one surface of a polyimide substrate, a high transmissive filling is disposed inside the intaglio pattern, thus an overall transmittance of the polyimide substrate is enhanced. Furthermore, the filling having a certain range of a coefficient of thermal expansion is disposed in the intaglio pattern to maintain a heat resistance of the polyimide substrate, an element being required a high temperature process could be disposed on the polyimide substrate having an enhanced transmittance.


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