The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Mar. 18, 2021
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Hideki Shinkai, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A module () is provided with a substrate including a principal surface (), a plurality of electronic components (, and) arranged on the principal surface (), a sealing resin () covering the principal surface (), a ground electrode arranged on the principal surface (), a conductive layer () covering the sealing resin (), and a magnetic member (). The conductive layer () is electrically connected to the ground electrode by a plurality of connecting conductors () arranged so as to penetrate the sealing resin (), and the magnetic member () includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin () and a magnetic member wall-shaped portion () arranged in a wall shape in the sealing resin (). The magnetic member wall-shaped portion () is longer than each of the connecting conductors ().