The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Apr. 14, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Anubhav Srivastava, Bangalore, IN;

Bhaskar Prasad, Jamshedpur, IN;

Kirankumar Neelasandra Savandaiah, Bangalore, IN;

Thomas Brezoczky, Los Gatos, CA (US);

Srinivasa Rao Yedla, Bangalore, IN;

Lakshmikanth Krishnamurthy Shirahatti, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67742 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.


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