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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11646183 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Mar. 20, 2020

Substrate support assembly with arc resistant coolant conduit

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Stephen Donald Prouty, San Jose, CA (US);

Alvaro Garcia De Gorordo, San Francisco, CA (US);

Andreas Schmid, Meyriez, CH;

Andrew Antoine Noujaim, Morgan Hill, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Ram N Kackar

Assistant Examiner:

Laureen Chan

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32798 (2013.01); H01J 37/3244 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67069 (2013.01); H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01);
Abstract

Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

Find Patent Forward Citations

Prouty, Stephen. (2023). Substrate support assembly with arc resistant coolant conduit (U.S. Patent No. 11646183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11646183

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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