The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Feb. 03, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Gaku Echigoya, Tokyo, JP;

Hiroshi Satou, Tokyo, JP;

Keijiro Ishida, Tokyo, JP;

Hajime Kudo, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 1/12 (2006.01); H01G 4/002 (2006.01); G06K 19/06 (2006.01);
U.S. Cl.
CPC ...
G06K 1/12 (2013.01); H01G 4/002 (2013.01); G06K 19/06037 (2013.01);
Abstract

In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.


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