The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Mar. 10, 2020
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Raymond Sarkissian, Studio City, CA (US);

Keyvan Sayyah, Santa Monica, CA (US);

Shuoqin Wang, Westlake, CA (US);

Biqin Huang, Rancho Palos Verdes, CA (US);

Ivan Alvarado, Santa Monica, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/48 (2006.01); G01S 7/481 (2006.01); G01S 7/4911 (2020.01); G01S 7/4912 (2020.01); G01S 17/88 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G01S 17/10 (2020.01); G02F 1/095 (2006.01); B60R 11/00 (2006.01); G02F 1/01 (2006.01);
U.S. Cl.
CPC ...
G01S 7/4818 (2013.01); G01S 7/4813 (2013.01); G01S 7/4814 (2013.01); G01S 7/4815 (2013.01); G01S 7/4816 (2013.01); G01S 7/4817 (2013.01); G01S 7/4911 (2013.01); G01S 7/4916 (2013.01); G01S 17/10 (2013.01); G01S 17/88 (2013.01); G02B 6/12004 (2013.01); G02B 6/1228 (2013.01); G02F 1/0955 (2013.01); B60R 11/00 (2013.01); G02B 2006/1215 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12097 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12147 (2013.01); G02F 1/0147 (2013.01);
Abstract

An architecture for a chip-scale optical phased array-based scanning frequency-modulated continuous wave (FMCW) Light-detection and ranging (LiDAR) device is described. The LiDAR device includes a laser, a transmit optical splitter, an optical circulator, photodetectors, and an optical phased array. The laser, the transmit optical splitter, the optical circulator, the photodetectors, and the optical phased array are arranged as a chip-scale package on a single semiconductor substrate. The laser generates a first light beam that is transmitted to the optical phased array aperture via the transmit optical splitter, the optical circulator, and the optical phased array. A fraction of the first light beam is transmitted to the photodetectors via the transmit optical splitter to serve as the optical local oscillator (LO), the aperture of the optical phased array captures a second light beam that is transmitted to the photodetectors via the optical phased array and the optical circulator.


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