The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Sep. 21, 2020
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Tao Song, Shenzhen, CN;
Zhongfeng Yang, Shenzhen, CN;
XiYuan Yin, Guangzhou, CN;
Xiao Hu, Shenzhen, CN;
LiCen Mu, Shenzhen, CN;
Mingman Li, Shenzhen, CN;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/304 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2813 (2013.01); G01R 31/2818 (2013.01); G01R 31/304 (2013.01); H05K 1/0268 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/42 (2013.01); H05K 2203/06 (2013.01); H05K 2203/162 (2013.01);
Abstract
A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.