The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Jun. 24, 2021
Applicant:
Spts Technologies Limited, Newport, GB;
Inventors:
Assignee:
SPTS TECHNOLOGIES LIMITED, Newport, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 17/06 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 17/004 (2013.01); C25D 17/06 (2013.01); H01L 21/6719 (2013.01); H01L 21/6723 (2013.01); H01L 21/67178 (2013.01); H01L 21/67196 (2013.01); H01L 21/67766 (2013.01); H01L 21/67769 (2013.01); H01L 21/67778 (2013.01); H01L 21/68707 (2013.01); H01L 21/2885 (2013.01);
Abstract
A method of processing a semiconductor wafer is provided. The method includes introducing the wafer to a main chamber via a loading port, using a transfer mechanism to transfer the wafer to a first wafer processing module in a stack so that the wafer is disposed substantially horizontally in the first wafer processing module with a front face facing upwards, and performing a processing step on the front face of the wafer in the first wafer processing module.