The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Oct. 05, 2021
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Wu-Han Liu, Miaoli County, TW;

Yi-Liang Liao, Changhua County, TW;

Tai-Sheng Chen, Hsinchu County, TW;

Wei-Tien Hsiao, Hsinchu County, TW;

Chang-Chih Hsu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 4/10 (2016.01); C23C 4/06 (2016.01); C22C 29/06 (2006.01); B32B 15/01 (2006.01); B32B 3/26 (2006.01); B32B 15/20 (2006.01); B32B 15/04 (2006.01); C22C 32/00 (2006.01); C22C 29/02 (2006.01); C22C 30/00 (2006.01); C22C 1/05 (2023.01); C22C 29/14 (2006.01); C22C 1/051 (2023.01); C22C 29/00 (2006.01); C22C 21/00 (2006.01); C23C 4/067 (2016.01); B32B 3/30 (2006.01); C22C 1/02 (2006.01); C22C 1/053 (2023.01);
U.S. Cl.
CPC ...
C23C 4/10 (2013.01); B32B 3/26 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 15/016 (2013.01); B32B 15/017 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C22C 1/026 (2013.01); C22C 1/05 (2013.01); C22C 1/051 (2013.01); C22C 1/053 (2013.01); C22C 21/00 (2013.01); C22C 29/005 (2013.01); C22C 29/02 (2013.01); C22C 29/06 (2013.01); C22C 29/062 (2013.01); C22C 29/14 (2013.01); C22C 30/00 (2013.01); C22C 32/0005 (2013.01); C22C 32/0052 (2013.01); C22C 32/0057 (2013.01); C22C 32/0073 (2013.01); C23C 4/06 (2013.01); C23C 4/067 (2016.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2311/24 (2013.01); B32B 2313/02 (2013.01); Y10T 428/1275 (2015.01); Y10T 428/12361 (2015.01); Y10T 428/12368 (2015.01); Y10T 428/12493 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12736 (2015.01); Y10T 428/12743 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12764 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/26 (2015.01);
Abstract

A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.


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