The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Mar. 26, 2019
Applicant:

Shpp Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Jian Wang, Shanghai, CN;

Shijie Song, Shanghai, CN;

Yaqin Zhang, Shanghai, CN;

Assignee:

SHPP Global Technologies B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08J 3/20 (2006.01); C08L 71/12 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08J 3/203 (2013.01); C08L 71/123 (2013.01); H05K 1/024 (2013.01); H05K 1/0373 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01); C08L 2207/066 (2013.01); H05K 2201/0158 (2013.01);
Abstract

A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.


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