The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Apr. 30, 2020
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Fuji Polymer Industries Co., Ltd., Nagoya, JP;
Yuichi Tominaga, Aichi, JP;
Yoshiki Sugimoto, Aichi, JP;
Yusuke Imai, Aichi, JP;
Yuji Hotta, Aichi, JP;
Setsuo Kikuchi, Aichi, JP;
Makoto Iwai, Aichi, JP;
Takumi Kataishi, Aichi, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Fuji Polymer Industries Co., Ltd., Aichi, JP;
Abstract
Composite resin granulescontain a binder resinand a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive fillerand an anisotropic thermally conductive filler. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive fillerare oriented in random directions. A thermally conductive rein molded bodyof the present invention is obtained by compressing the composite resin granules. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.