logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11643544 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Sep. 17, 2018

Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

Applicant:

Taiwan Union Technology Corporation, Chupei, TW;

Inventors:

Chih-Wei Liao, Chupei, TW;

Ju-Ming Huang, Chupei, TW;

Guan-Syun Tseng, Chupei, TW;

Assignee:

TAIWAN UNION TECHNOLOGY CORPORATION, Chupei, TW;

Attorney:

Greer, Burns & Crain, Ltd

Primary Examiner:

Callie E Shosho

Assistant Examiner:

Bethany M Miller

Int. Cl.
CPC ...
C08L 63/00 (2006.01); H05K 1/03 (2006.01); C08K 5/3492 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 5/00 (2006.01); C08J 5/24 (2006.01); C08K 5/42 (2006.01); C08K 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/36 (2013.01); C08K 5/0066 (2013.01); C08K 5/3492 (2013.01); H05K 1/0373 (2013.01); C08J 2363/02 (2013.01); C08K 5/18 (2013.01); C08K 5/42 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01);
Abstract

A resin composition is provided. The resin composition includes the following constituents: wherein, Rto Rand A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

Find Patent Forward Citations

Liao, Chih-Wei. (2023). Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same (U.S. Patent No. 11643544). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11643544

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…