The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Oct. 01, 2020
Applicant:

Nova Chemicals (International) S.a., Fribourg, CH;

Inventors:

XiaoChuan Wang, Calgary, CA;

Peter Zoricak, Calgary, CA;

Brian Molloy, Airdrie, CA;

Norman Aubee, Calgary, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/08 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); C08L 23/06 (2006.01);
U.S. Cl.
CPC ...
C08L 23/08 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); C08L 23/06 (2013.01); B32B 2250/242 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

A thermoformable film comprises a polyethylene composition. The polyethylene composition comprises a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution M/Mof <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 15,000 to 100,000 and a molecular weight distribution M/Mof <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution M/Mof >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a melt flow ratio (I/I) of ≤50 and an area Dimensional Thermoformability Index (aDTI) at 105° C. of less than 15.


Find Patent Forward Citations

Loading…