The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Apr. 03, 2020
Applicant:

Ohio State Innovation Foundation, Columbus, OH (US);

Inventors:

David J. Hoelzle, Columbus, OH (US);

Desmond M. D'Souza, Columbus, OH (US);

Andrej Simeunovic, Columbus, OH (US);

Ali Asghari Adib, Columbus, OH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B33Y 10/00 (2015.01); C12N 5/00 (2006.01); B29K 105/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B33Y 10/00 (2014.12); C12N 5/0062 (2013.01); B29K 2105/0061 (2013.01); B29L 2031/753 (2013.01);
Abstract

The present disclosure provides methods for freeform extrusion-based additive manufacturing via a robotic arm. In specific aspects, methods are particularly provided for minimally invasive, intracorporeal three-dimensional printing of biocompatible materials. An end effector of a robotic arm includes a sharp member and a reservoir filled with a printing material. The provided method may include piercing a substrate with the sharp member. A bulb or microbolus of material may be extruded beneath the substrate surface to act as an anchor. The end effector may be manipulated to extrude biomaterial along a printing path. Periodically along the printing path, the sharp member is used to pierce the substrate surface create additional respective anchors. In some instances, the method may terminate after extruding material to form a single layer construct. In other instances, the method includes forming one or more layers on top of the initial base layer anchored to the substrate.


Find Patent Forward Citations

Loading…