The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Aug. 23, 2018
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventors:
Assignee:
FUJIFILM HEALTHCARE CORPORATION, Chiba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/02 (2006.01); A61B 8/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0292 (2013.01); A61B 8/4444 (2013.01); A61B 8/54 (2013.01); H01L 23/4985 (2013.01); H01L 24/08 (2013.01); B06B 2201/76 (2013.01); H01L 2224/16227 (2013.01);
Abstract
An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.