The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Aug. 10, 2021
Applicant:

Altek Biotechnology Corporation, Hsinchu, TW;

Inventors:

Ting-Cheng Ke, Hsinchu, TW;

Chao-Yu Chou, Hsinchu, TW;

Po-Ju Chen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); A61B 1/07 (2006.01); A61B 1/00 (2006.01); A61B 1/06 (2006.01); H04N 23/54 (2023.01); H04N 23/56 (2023.01); H04N 23/50 (2023.01);
U.S. Cl.
CPC ...
A61B 1/051 (2013.01); A61B 1/0011 (2013.01); A61B 1/0676 (2013.01); A61B 1/07 (2013.01); H04N 23/54 (2023.01); H04N 23/56 (2023.01); H04N 23/555 (2023.01);
Abstract

An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.


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