The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Sep. 01, 2021
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventors:

Jianing Chen, Northville, MI (US);

Jon Curry, Commerce Township, MI (US);

David Jia, Canton, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 5/04 (2006.01); H05K 5/06 (2006.01); H05K 3/34 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3457 (2013.01); H05K 1/0215 (2013.01); H05K 5/0008 (2013.01);
Abstract

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.


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