The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Feb. 11, 2021
Applicant:

Teradiode, Inc., Wilmington, MA (US);

Inventors:

Won Tae Lee, Highlands Ranch, CO (US);

Michael Deutsch, Derry, NH (US);

Zhongyong Liu, Dracut, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/18 (2006.01); G02B 7/18 (2021.01); G02B 27/44 (2006.01); H01S 5/0237 (2021.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01); H01S 5/14 (2006.01); H01S 5/0236 (2021.01); H01S 5/02345 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02476 (2013.01); G02B 5/1814 (2013.01); G02B 7/1815 (2013.01); G02B 27/44 (2013.01); H01S 5/0237 (2021.01); H01S 5/4062 (2013.01); H01S 5/4075 (2013.01); H01S 5/4081 (2013.01); H01S 5/0236 (2021.01); H01S 5/02345 (2021.01); H01S 5/143 (2013.01); H01S 5/4087 (2013.01);
Abstract

In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.


Find Patent Forward Citations

Lee, Won. (2023). High-power laser packaging utilizing carbon nanotubes between metallic bonding materials (U.S. Patent No. 11641092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11641092

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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