logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11640966 B1

PDFFull Text
Date of Patent:
May. 02, 2023

Filed:

Feb. 07, 2022

Photosensitive assembly, method for manufacturing same, and electronic device comprising a vibration member to vibrate an orthographic projection region of a light sensor on a light transmissive substrate in an undulated shape

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xiaotong Liu, Beijing, CN;

Yuju Chen, Beijing, CN;

Assignee:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

IPro, PLLC

Primary Examiner:

Que Tan Le

Assistant Examiner:

Mai Thi Ngoc Tran

Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); G06V 40/1312 (2022.01);
Abstract

Disclosed are a photosensitive assembly, a method for manufacturing the same, and an electronic device. The photosensitive assembly includes a light-transmissive substrate, a light sensor, and a vibration member. The light sensor is disposed on a side of the light-transmissive substrate, and the vibration member is configured to drive the light-transmissive substrate to vibrate, such that a photosensitive area of the light-transmissive substrate is in an undulated shape.

Find Patent Forward Citations

Quick Actions:

Liu, Xiaotong. (2023). Photosensitive assembly, method for manufacturing same, and electronic device comprising a vibration member to vibrate an orthographic projection region of a light sensor on a light transmissive substrate in an undulated shape (U.S. Patent No. 11640966). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11640966

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…