The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Feb. 28, 2020
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Mi Sun Hwang, Suwon-si, KR;
Dae Jung Byun, Suwon-si, KR;
Chang Hwa Park, Suwon-si, KR;
Sang Ho Jeong, Suwon-si, KR;
Jun Hyeong Jang, Suwon-si, KR;
Ki Ho Na, Suwon-si, KR;
Je Sang Park, Suwon-si, KR;
Yong Duk Lee, Suwon-si, KR;
Yoo Rim Cha, Suwon-si, KR;
Yeo Il Park, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.