The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Mar. 11, 2021
Applicant:

Mellanox Technologies, Ltd., Yokneam, IL;

Inventors:

Pavel Vilner, Haifa, IL;

Dmitry Fliter, Kiryat Yam, IL;

Jacov Brener, Rosh Ha'ayin, IL;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H05K 3/3436 (2013.01);
Abstract

Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.


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