The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Oct. 29, 2019
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Yuji Ichimura, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/08 (2006.01); H01L 23/057 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/057 (2013.01); H01L 23/08 (2013.01); H01L 23/3675 (2013.01); H01L 24/48 (2013.01); H01L 25/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48177 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip, a substrate having a main surface on which the semiconductor chip is arranged, a resin case which has a storage space therein and a side wall, the side wall having an injection path extending from the storage space to a device exterior, the resin case having a first opening at a bottom side thereof, connecting the storage space to the device exterior, the substrate being disposed on the resin case, at a main surface side of the substrate facing at the bottom side of the resin case, and a sealing material filling the storage space and the injection path.