The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Aug. 05, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Keito Yonemori, Nagaokakyo, JP;

Hirokazu Yazaki, Nagaokakyo, JP;

Takanori Tsuchiya, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); H01R 12/52 (2011.01); H01R 12/57 (2011.01); H01R 12/62 (2011.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01B 7/08 (2013.01); H01L 23/49531 (2013.01); H01R 12/52 (2013.01); H01R 12/57 (2013.01); H01R 12/62 (2013.01); H05K 1/0201 (2013.01); H05K 1/0221 (2013.01); H05K 1/141 (2013.01); H05K 1/148 (2013.01); H05K 1/181 (2013.01); H05K 3/36 (2013.01); H01B 7/0838 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/176 (2013.01);
Abstract

A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.


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