IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11640110 B1

PDFFull Text
Date of Patent:
May. 02, 2023

Filed:

Feb. 25, 2020

Resin composition, method for producing heat-resistant resin film, and display device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Keika Hashimoto, Otsu, JP;

Kazuto Miyoshi, Otsu, JP;

Masao Tomikawa, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/022 (2006.01); G03F 7/023 (2006.01); C08L 101/02 (2006.01); H01L 21/027 (2006.01); H01L 29/786 (2006.01); G03F 7/037 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); C09D 179/08 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0226 (2013.01); C08L 101/02 (2013.01); G03F 7/0046 (2013.01); G03F 7/0233 (2013.01); G03F 7/0236 (2013.01); G03F 7/037 (2013.01); G03F 7/0387 (2013.01); G03F 7/40 (2013.01); H01L 21/027 (2013.01); H01L 29/786 (2013.01); H10K 50/87 (2023.02); H10K 59/124 (2023.02); C09D 179/08 (2013.01); H10K 59/122 (2023.02);
Abstract

A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

Find Patent Forward Citations

Loading…