The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Jul. 02, 2021
Kelsey Mccusker, Sparrows Point, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Jonathan Shane Atienza, Satellite Beach, FL (US);
Jonathan Francis Van Dyke, East Elmhurst, NY (US);
Kevin Collao, Rosedale, MD (US);
Kelsey McCusker, Sparrows Point, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Jonathan Shane Atienza, Satellite Beach, FL (US);
Jonathan Francis Van Dyke, East Elmhurst, NY (US);
Kevin Collao, Rosedale, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.