The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Jun. 18, 2021
Applicant:

Wistron Neweb Corporation, Hsinchu, TW;

Inventors:

Yan-Da Chen, Hsinchu, TW;

Chien-Ming Peng, Hsinchu, TW;

Yu-Jen Liu, Hsinchu, TW;

Chih-Chuan Lin, Hsinchu, TW;

Chi-Te Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2049 (2013.01); H01L 23/367 (2013.01); H05K 7/20472 (2013.01); H05K 9/0024 (2013.01);
Abstract

An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.


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