The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Mar. 18, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Seon Ha Kang, Suwon-si, KR;
Yong Hoon Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01); H01L 25/065 (2023.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01); H01L 21/56 (2006.01); H05K 3/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H05K 1/181 (2013.01); H05K 3/108 (2013.01); H05K 3/284 (2013.01); H05K 9/0022 (2013.01); H05K 3/16 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09972 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1469 (2013.01);
Abstract
A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.