The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jan. 04, 2021
Conti Temic Microelectronic Gmbh, Nuremberg, DE;
Alexander Brandhuber, Lindau, DE;
Karsten Breuer, Oberreute, DE;
Thomas Wichmann, Lindau, DE;
Manfred Gantner, Lindau, DE;
Manuel Walter, Lochau, AT;
Conti Temic microelectronic GmbH, Nuremberg, DE;
Abstract
An apparatus and a method for bundling two data channels via a point-to-point connection, is described herein. Sequences of data from a first data channel are transmitted via a first line and sequences of data from a second data channel are transmitted via a second line to a multiplexing apparatus. A data gap having a predefined size is arranged between two sequences of first data in each case. The data from the second data channel are transmitted to a buffer and, if the buffer has been filled with second data having a predefined size, are inserted into the data from the first data channel. A third data channel is formed at the output of the multiplexing apparatus using these first data and second data and is transmitted to a third line. The third data channel therefore has a bundling of sequences of first data and sequences of second data.