The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jul. 23, 2019
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Yutaka Nakada, Kanagawa, JP;
Satoshi Okada, Kanagawa, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03M 13/11 (2006.01); H03M 13/15 (2006.01); H03M 13/27 (2006.01); H03M 13/29 (2006.01); H04L 1/00 (2006.01);
U.S. Cl.
CPC ...
H03M 13/1105 (2013.01); H03M 13/152 (2013.01); H03M 13/2792 (2013.01); H03M 13/2927 (2013.01); H04L 1/0071 (2013.01);
Abstract
There is provided a decoding circuit including; a first decoding unit that decodes a first signal from a multiplexed signal in which the first signal and a second signal are multiplexed in an LDM (Layered Division Multiplexing) system; and a second decoding unit that decodes the second signal from the multiplexed signal using the decoding result of the decoded first signal, wherein the second signal is selectively decoded based on noise information related to a reception state of the multiplexed signal.