The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Nov. 22, 2019
Applicant:

Rogers Corporation, Chandler, AZ (US);

Inventors:

Gianni Taraschi, Arlington, MA (US);

Kristi Pance, Auburndale, MA (US);

Stephen O'Connor, West Roxbury, MA (US);

Christopher Brown, Natick, MA (US);

Trevor Polidore, Scottsdale, MA (US);

Allen F. Horn, III, Pomfret Center, CT (US);

Dirk Baars, Phoenix, AZ (US);

Roshin Rose George, Burlington, MA (US);

Jared Duperre, South Portland, ME (US);

Shailesh Pandey, Woburn, MA (US);

Karl E. Sprentall, Medford, MA (US);

Shawn P. Williams, Andover, MA (US);

William Blasius, Charlton, MA (US);

Assignee:

ROGERS CORPORATION, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01P 7/10 (2006.01); H01P 1/208 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0485 (2013.01); H01P 1/2084 (2013.01); H01P 7/10 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/061 (2013.01);
Abstract

A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.


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