The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Feb. 17, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 21/06 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 21/00 (2006.01); H01Q 1/52 (2006.01); H01Q 21/28 (2006.01); H01Q 9/04 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 1/523 (2013.01); H01Q 9/0457 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/065 (2013.01); H01Q 21/28 (2013.01);
Abstract
An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.