The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Oct. 08, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Hung-Wen Lin, Kaohsiung, TW;

Sin-Shong Wang, Taipei, TW;

Jen-Chun Chang, New Taipei, TW;

Ajit Kumar Vallabhaneni, Carlsbad, CA (US);

Keith Wang, Taoyuan, TW;

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/552 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01); H01L 23/427 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); G06F 1/1656 (2013.01); G06F 1/206 (2013.01); H01L 23/552 (2013.01); G06F 1/203 (2013.01); H01L 23/367 (2013.01); H01L 23/427 (2013.01); H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 7/20336 (2013.01);
Abstract

An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.


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