The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Dec. 24, 2020
Applicant:

Playnitride Display Co., Ltd., MiaoLi County, TW;

Inventors:

Hsiang-Wen Tang, MiaoLi County, TW;

Yu-Hung Lai, MiaoLi County, TW;

Assignee:

PlayNitride Display Co., Ltd., MiaoLi County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); G09G 3/00 (2006.01); H01L 33/62 (2010.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); G01R 31/2635 (2013.01); G09G 3/006 (2013.01); H01L 27/156 (2013.01); H01L 33/382 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01);
Abstract

A micro LED display includes a display substrate, a first soldering layer, at least one second soldering layer, first micro LEDs and at least one second micro LED. The display substrate includes a substrate having a plurality of pixel areas, a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are arranged in each pixel area. The first soldering layer is disposed on the first circuit layer, and the second soldering layer is disposed on the second micro LED. An arranging area of the first soldering layer is greater than an arranging area of the second soldering layer. The first micro LEDs is bonding to the first circuit layer in each pixel area through the first soldering layer. The second micro LED is bonding to the second circuit layer of one of the pixel areas through the second soldering layer.


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