The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Aug. 03, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chang Sun Hwang, Hwaseong-si, KR;

Han Sol Seok, Hwaseong-si, KR;

Hyun Ku Kang, Hwaseong-si, KR;

Byoung Ho Kwon, Hwaseong-si, KR;

Chung Ki Min, Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3105 (2006.01); H01L 25/065 (2023.01); H01L 21/762 (2006.01); H01L 27/11582 (2017.01); H01L 29/06 (2006.01); H01L 27/11556 (2017.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31053 (2013.01); H01L 21/76229 (2013.01); H01L 21/78 (2013.01); H01L 25/0657 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 29/0642 (2013.01);
Abstract

A semiconductor device includes a stacked structure on a substrate. The stacked structure includes stepped regions and a central region between the stepped regions, an upper insulation layer on the stacked structure, and a capping insulation layer on the stepped regions of the stacked structure. The capping insulation layer includes a first upper end portion and a second upper end portion that are adjacent to the upper insulation layer. The upper insulation layer is between the first upper end portion and the second upper end portion. The first upper end portion and the second upper end portion extends a first height relative to the substrate that is different from a second height relative to the substrate of the second upper end portion.


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