The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Apr. 29, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jae Seok Yi, Suwon-si, KR;
Jung Min Kim, Suwon-si, KR;
Bon Seok Koo, Suwon-si, KR;
Chang Hak Choi, Suwon-si, KR;
Il Ro Lee, Suwon-si, KR;
Byung Woo Kang, Suwon-si, KR;
San Kyeong, Suwon-si, KR;
Hae Sol Kang, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.