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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11635691 B1

PDFFull Text
Date of Patent:
Apr. 25, 2023

Filed:

Jul. 06, 2020

Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Joetsu, JP;

Takashi Sawamura, Joetsu, JP;

Keisuke Niida, Joetsu, JP;

Seiichiro Tachibana, Joetsu, JP;

Takeru Watanabe, Joetsu, JP;

Tsutomu Ogihara, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
G03F 7/09 (2006.01); C08G 61/12 (2006.01); C08G 61/10 (2006.01); C08J 5/18 (2006.01); G03F 7/16 (2006.01); G03F 7/075 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); C08G 61/10 (2013.01); C08G 61/12 (2013.01); C08G 61/124 (2013.01); C08J 5/18 (2013.01); G03F 7/0757 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/2022 (2013.01); G03F 7/325 (2013.01); G03F 7/327 (2013.01); H01L 21/0276 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); C08G 2261/124 (2013.01); C08G 2261/1414 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/312 (2013.01); C08G 2261/3142 (2013.01); C08G 2261/3241 (2013.01); C08G 2261/3245 (2013.01); C08G 2261/334 (2013.01); C08J 2365/00 (2013.01);
Abstract

A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; Wrepresents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W; and Wrepresents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer.

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