The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jul. 14, 2021
Jilin University, Changchun, CN;
Hongwei Zhao, Changchun, CN;
Zhaoxin Wang, Changchun, CN;
Jianhai Zhang, Changchun, CN;
Peng Liu, Changchun, CN;
Shunbo Wang, Changchun, CN;
Cong Li, Changchun, CN;
Xiangyu Zong, Changchun, CN;
Shuilong Zhou, Changchun, CN;
Honglong Li, Changchun, CN;
Jiru Wang, Changchun, CN;
Meng Zhang, Changchun, CN;
Wenyang Wang, Changchun, CN;
Jilin University, Changchun, CN;
Abstract
The present disclosure relates to a traceable in-situ micro- and nano-indentation testing instrument and method under variable temperature conditions. A macro-micro switchable mechanical loading module, a nano mechanical loading module and an indentation position optical positioning module are fixed on a gantry beam, an optical imaging axis of an optical microscopic in-situ observation or alignment module and a loading axis of the nano mechanical loading module are coplanar, the optical microscopic in-situ observation or alignment module and the function switchable module are mounted on a table top of a marble pedestal, and a contact or ambient mixed variable temperature module is fixedly mounted on the function switchable module. A modular design is adopted, the micro- and nano-indentation testing instrument is used as a core, in combination with a multi-stage vacuum or ambient chamber, an indentation depth traceability calibration module and multiple sets of optical microscopic imaging assemblies.