The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jan. 26, 2021
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Teppei Kunimune, Tokushima, JP;
Masafumi Kuramoto, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/10 (2022.01); C09D 5/24 (2006.01); B22F 9/30 (2006.01); C09D 7/40 (2018.01); H01B 1/22 (2006.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 9/30 (2013.01); C09D 7/68 (2018.01); H01B 1/22 (2013.01); B22F 2201/03 (2013.01); B22F 2201/50 (2013.01); B22F 2301/255 (2013.01); B22F 2998/10 (2013.01);
Abstract
There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.