The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jun. 15, 2018
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventors:
Sanjay Malik, Attleboro, MA (US);
William A. Reinerth, Riverside, RI (US);
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 283/04 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); C08G 73/06 (2006.01); C09D 179/08 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); C09J 4/00 (2006.01); C09D 4/06 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08F 283/04 (2013.01); C08G 73/0672 (2013.01); C09D 4/06 (2013.01); C09D 179/08 (2013.01); C09J 4/00 (2013.01); H01L 21/481 (2013.01); H01L 23/145 (2013.01); H01L 23/3142 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01);
Abstract
This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.