The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Nov. 15, 2021
Applicant:
Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;
Inventors:
Assignee:
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 36/06 (2006.01); C08L 9/06 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01); C08L 25/06 (2006.01); C08F 12/12 (2006.01); C08F 20/18 (2006.01);
U.S. Cl.
CPC ...
C08F 36/06 (2013.01); C08J 5/24 (2013.01); C08L 9/06 (2013.01); C08F 12/12 (2013.01); C08F 20/18 (2013.01); C08L 25/06 (2013.01); C08L 71/126 (2013.01); C08L 2201/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01);
Abstract
A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.