The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Feb. 08, 2018
Applicant:

Samco Inc., Kyoto, JP;

Inventors:

Hirokazu Terai, Koka, JP;

Risa Funahashi, Kyoto, JP;

Tomoyasu Nishimiya, Otokuni-gun, JP;

Assignee:

SAMCO INC., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/028 (2013.01); B29C 66/0012 (2013.01); B29C 66/72326 (2013.01); B29K 2023/38 (2013.01);
Abstract

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to HO plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.


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