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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11632886 B1

PDFFull Text
Date of Patent:
Apr. 18, 2023

Filed:

Oct. 07, 2020

Method of manufacturing electronic module, electronic module, and electronic device

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Mitsutoshi Hasegawa, Kanagawa, JP;

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 23/10 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 25/03 (2006.01); H01L 25/16 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 27/146 (2006.01); H05K 3/34 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H01L 21/4867 (2013.01); H01L 21/50 (2013.01); H01L 24/32 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H05K 3/3442 (2013.01); H01L 2021/60135 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

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